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RO4725JXR PCB double-sided copper 0.8mm Thick, 30.7mil Core, and ENIG Finish for Antenna Applications

Shenzhen Bicheng Electronics Technology Co., Ltd
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RO4725JXR PCB double-sided copper 0.8mm Thick, 30.7mil Core, and ENIG Finish for Antenna Applications

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Brand Name : Rogers

Model Number : RO4725JXR

Certification : ISO9001

Place of Origin : China

MOQ : 1PCS

Price : 2.99USD/pcs

Payment Terms : T/T, Paypal

Supply Ability : 50000pcs

Delivery Time : 2-10 working days

Packaging Details : Packing

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2-Layer RO4725JXR PCB: 0.8mm Thick, 30.7mil Core, and ENIG Finish for Antenna Applications

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

Overview of the 2-Layer RO4725JXR PCB

The 2-layer RO4725JXR PCB is a cost-effective, high-performance printed circuit board designed specifically for antenna-grade applications. Manufactured using Rogers RO4725JXR hydrocarbon/ceramic laminate, this PCB offers low dielectric loss, consistent circuit performance, and reduced passive intermodulation (PIM). With a finished thickness of 0.8mm, immersion gold surface finish, and rigid structure, this PCB is optimized for cellular base station antennas and other demanding RF systems.

Fully compatible with standard FR-4 processes, the RO4725JXR PCB eliminates the need for specialized handling, making it an affordable alternative to PTFE-based laminates without compromising performance.

RO4725JXR PCB double-sided copper 0.8mm Thick, 30.7mil Core, and ENIG Finish for Antenna Applications

PCB Construction Details

The 2-layer rigid PCB is engineered with precision to ensure durability and superior signal performance. Below are the construction details:

Parameter Specification
Base Material Rogers RO4725JXR
Layer Count 2 layers
Board Dimensions 53mm x 79mm ± 0.15mm
Minimum Trace/Space 4/7 mils
Minimum Hole Size 0.3mm
Blind Vias No
Finished Thickness 0.8mm
Copper Weight 1oz (1.4 mils) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold (ENIG)
Top Silkscreen None
Bottom Silkscreen None
Top Solder Mask None
Bottom Solder Mask None
Electrical Testing 100% tested prior to shipment

PCB Stackup

Layer Material Thickness
Copper Layer 1 Copper (1oz) 35 μm
Core Material Rogers RO4725JXR 0.78mm (30.7mil)
Copper Layer 2 Copper (1oz) 35 μm

This straightforward stackup design ensures low insertion loss and stable signal propagation, making it ideal for RF applications.

PCB Statistics

The 2-layer RO4725JXR PCB is designed to meet the needs of simple but effective component layouts. Below are its key statistics:

  • Components: 6
  • Total Pads: 39
  • Thru Hole Pads: 31
  • Top SMT Pads: 8
  • Bottom SMT Pads: 0
  • Vias: 20
  • Nets: 2

Introduction to RO4725JXR Material

Rogers RO4725JXR laminates are a hydrocarbon/ceramic composite reinforced with woven glass, designed to provide antenna-grade performance at a lower cost compared to PTFE-based laminates. The material’s low dielectric constant (Dk) and low loss tangent (Df) ensure minimal signal loss and consistent electrical performance.

RO4725JXR materials are fully compatible with FR-4 processes, eliminating the need for special handling or through-hole preparation. Additionally, the material’s low passive intermodulation (PIM) performance ensures superior signal quality in cellular base station antennas.

Features of RO4725JXR

  • Dielectric Constant (Dk): 2.55 ± 0.05 at 10GHz/23°C
  • Dissipation Factor (Df):
  • 0.0026 at 10GHz/23°C
  • 0.0022 at 2.5GHz
  • Thermal Coefficient of Dielectric Constant (TCDk): +34 ppm/°C
  • CTE (Coefficient of Thermal Expansion):
  • X-axis: 13.9 ppm/°C
  • Y-axis: 19 ppm/°C
  • Z-axis: 25.6 ppm/°C
  • High Tg Value: >280°C
  • Low PIM Performance: -166 dBc (43dBm, 1,900MHz signal)

Benefits of RO4725JXR PCB

Low Dielectric Loss: Ensures minimal signal attenuation for high-frequency applications.

Consistent Circuit Performance: Dk and Df values are stable across wide frequency ranges.

Low Passive Intermodulation (PIM): Improves signal quality in antenna systems.

Cost-Effective Alternative: Matches PTFE-based materials in performance without the high cost.

Thermal Stability: High Tg and CTE matched to copper enhance durability during operation.

Applications of RO4725JXR PCB

Cellular Base Station Antennas: Delivers reliable signal performance and low PIM.

Point-to-Point Communication Systems: Supports low-loss and high-gain applications.

Microwave and RF Systems: Ensures consistent performance for high-frequency circuits.

Satellite Communication Systems: Provides thermal and electrical stability in demanding environments.

Why Choose the 2-Layer RO4725JXR PCB?

The 2-layer RO4725JXR PCB combines optimal performance, cost efficiency, and easy manufacturability, making it an excellent choice for antenna-related applications. With its low dielectric constant, low dissipation factor, and superior thermal properties, this PCB ensures long-lasting performance in high-frequency environments.

Contact us today to learn more about this high-performance PCB or to discuss your project requirements!

RO4725JXR PCB double-sided copper 0.8mm Thick, 30.7mil Core, and ENIG Finish for Antenna Applications


China RO4725JXR PCB double-sided copper 0.8mm Thick, 30.7mil Core, and ENIG Finish for Antenna Applications wholesale

RO4725JXR PCB double-sided copper 0.8mm Thick, 30.7mil Core, and ENIG Finish for Antenna Applications Images

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